Sun SPARC Enterprise M4000 Hardware Specifications



Processor Options

Processor Specifications Up to 4 SPARC64 VI Dual core processors
SPARC V9 Architecture, ECC protected
Cache per SPARC64 Level 1: 128 KB D-cache and 128 KB I-cache
Level 2: 5 MB on-chip
Clock speed: 2.1GHz

System

System Specifications Up to 2 CPU boards (CMU), 2 CPUs per board
Main memory Up to 128 GB per domain / system, up to 4 memory boards with maximum 32GB per board using DDR2 4GB memory DIMMs
Up to 5 I/O slots with 4 PCIe slots each and 1 PCI-X on one I/O tray
Up to 25 PCIe or PCI-X slots with optional External I/O Expansion Unit
High-speed, low-latency interconnect system bus with redundant data, address, and response crossbar interconnect
System Bus bandwidth (Memory) 32GB/s PEAK, 12.7GB/s STREAM
System Bus bandwidth (IO) 8GB/s PEAK
2 1Gb Ethernet ports
Service Processor for system management
Up to 2 dynamic domains

Storage

Storage Specifications Boot device: Up to 2 internal, 2.5" SAS boot disks
External direct, SAN or NAS attach to Sun StorageTek compatible tape libraries and disk arrays, including Sun StorageTek 3X00, 5X00, 6X00, and 9X00 families

Resource Management

Resource Management Dynamic Domains, Solaris Resource Manager including Solaris Containers

Software

Software Specifications Solaris 10 (11/06)
Languages C, C++, Pascal, FORTRAN, Java
Networking ONC/NFS, TCP/IP, SunLink Netware
System Sun Management Center monitoring, Solaris Web Start, Solstice Domain Manager, Solstice Enterprise Manager, Solstice Backup
Value Added Software Sun Cluster, Sun HPC ClusterTools, Sun Java Enterprise System

Environmental

Power AC power 100–240 VAC 1-phase (50/60 Hz), 12 amp per power cord, 1-2 power cords
Plug NEMA-L6-20P (U.S.) or IEC 309-IP44 (INTL) IEC 60320 C19 connector.
Receptacle type: IEC 60320 C20
Operating temperature 5°C to 35°C (41°F to 95°F), 20% to 80% relative humidity, noncondensing
Nonoperating temperature -20°C to 60°C (-4°F to 140°F) 8% to 80% relative humidity, noncondensing
Altitude Up to 3048 m (10,000 ft.)

Regulations

Safety CSA/UL-60950, EN60950, IEC950 CB Scheme with all national deviations
RFI/EMC EN55022/CISPR22 Class A, FCC CFR47 Part 15 Class A, EN61000-3-2, EN61000-3-3
Immunity EN55024, EN61000-4-2, -4-3. -4-5. -4-6, -4-8 & -4/11
Regulatory Markings CE, FCC, ICES, C-tick, VCCI, GOST-R, BSMI, MIC, CSA/UL
Other Marks WEEE and Chinese RoHS

RAS

Key RAS Features End-to-end ECC protection
Guaranteed data path integrity
Automatic recovery
Auto-reconfiguration after reboot
Blacklist of failed field replacement units (FRUs)
Blacklist of failed ASIC's
Reconfiguration and recovery of centerplane with an ASIC failure
Instruction retry
Processor SRAM and register protection
ECC and and extended protection for memory
Memory mirroring
Predictive self-healing
Full hardware redundancy
Fault-isolated Dynamic Domains
Dynamic Reconfiguration
Auto Diagnosis and Recovery
Proactive self-diagnostics
Hot-swap of memory processors power cooling and I/O
Online upgrades (add new resources while system is operational)
Concurrent maintenance (service while system is operational)
Redundant network connections
Redundant storage connections
Hardened operating system kernel
Live operating system upgrades
Journaled file system
Hardened I/O drivers
CPU off-lining
Memory page retirement
Cluster support

Dimensions and Weight

Height 26.3 cm (10.34 in.)
Width 44.4 cm (17.48 in.)
Depth 81 cm (31.9 in.)
Weight 84 kg (185 lb.)